| Title | Adhesion Investigation Between Metal and Benzocyclobutene (BCB) Polymer Dielectric Materials in 3-D Integration Applications |
| Publication Type | Journal Article |
| Year of Publication | 2014 |
| Authors | Shih, J-Y, Huang, W-C, Ko, C-T, Yang, Z, Hu, S-H, Leu, J, Chou, KC, Chen, K-N |
| Journal | Ieee Transactions on Device and Materials Reliability |
| Volume | 14 |
| Pagination | 914-920 |
